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These are the product highlights we will be showcasing at PCIM Europe:
The Firecomms’ RedLink® 10–250 MBd product family delivers high-performance optical communication solutions engineered to increase data throughput, minimise electromagnetic interference (EMI), and leverage existing plastic optical fiber (POF) or PCS cabling infrastructure. Supporting data rates from 10 to 125 MBd, and scaling to 250 MBd for higher-speed applications, RedLink® devices enable reliable optical links without the need for shielding. With integrated pulse distortion correction and straightforward LVDS or TTL interfaces, the range supports seamless implementation across Ethernet, fieldbus, and proprietary protocols in demanding industrial environments.
The TOPSwitchGaN IC is an integrated switched-mode power supply that extends the maximum output power of a classic flyback converter to 440 W, offering a simpler alternative to complex resonant and LLC topology. It monitors an analog feedback current at the control input to modulate the variable-frequency variable-current control.
The TOPSwitchGaN flyback controller can operate in continuous conduction mode (CCM) or discontinuous conduction mode (DCM). The controller consists of a frequency-jitter oscillator, a current-limit controller, 5 V regulator on the BYPASS pin, BYPASS undervoltage and overvoltage detection circuit, an input-line sensing circuit, current -limit selection circuitry, over-temperature protection, leading-edge blanking, and a PowiGaN power switch.
As power densities continue to increase and designs become more compact, thermal management is gaining ever greater importance.
We would like to introduce a highly effective yet still relatively uncommon technology: Thermal Guides (LTG) from Lotus Microsystems.
These are thermally highly conductive, electrically insulating SMD components that are integrated directly into the PCB layout. They enable heat to be transferred efficiently from hotspots (e.g. ICs, FPGAs, and power semiconductors) to larger cooling areas or GND planes.
The key advantage:
Instead of relying solely on conventional cooling methods such as heat sinks or airflow management, heat distribution can already be actively optimized within the PCB design itself.
In practical applications, temperature reductions of more than 20 °C are possible.
